COM Express Sports 2 GHz i7 Processor

Gone are the days of a long gap between when a mainstream processor emerged and when it made its way into the military embedded board realm. Exemplifying that trend, several vendors have rolled out Intel i7-based products in the last month. The latest from ADLINK Technology is the Express-CBR. The Express-CBR COM Express module combines the latest high-performance Intel Core i7 processor running at up to 2.0 GHz with the advanced Mobile Intel QM57 Express chipset. The Express-CBR achieves hardware ruggedness by careful component selection and an extreme-rugged design methodology that gives reliable operation over a wide power supply range from 9V to 16V and over the extended temperature range of -40° to 85°C. (Figure 1)

The Express-CBR uses Extensible Firmware Interface (EFI) for a highly reliable, proven, versatile and adaptable BIOS layer that allows streamlined implementation of custom design-specific baseboard features. The powerful capabilities provided by EFI enable more in-depth control than ever before of the pre-boot and boot environments. The Express-CBR supports up to 8 Gbytes of DDR3 memory and provides onboard I/O interfaces for Gbit Ethernet, eight USB 2.0 ports, four SATA ports and an IDE (PATA) channel. Legacy support is also provided for PCI, LPC, SMBus and I²C. Single unit pricing of the Express-CBR starts at $1,299.

ADLINK. San Jose, CA. (408) 360-0200. [www.adlinktech.com].

3.5-inch CPU Using Atom Z510/Z530 Runs up to 1.6 GHz

The Intel Atom is a single core processor built on a 45 nm process that boasts an impressive 2.64 watts TDP (CPU only). The Intel Atom delivers the benefits of genuine Intel architecture to small form factor and thermally constrained military applications. The ADLS15HD from Advanced Digital Logic is a 3.5-inch embedded single board computer based on the Intel Atom and the Intel US15W (Poulsbo) chipset. (Figure 2)

The Intel graphics controller drives graphics up to 1600 x 1200 at 60 Hz by way of onboard DVI and/or 18/24-bit LVDS LCD. Memory is added via a SODIMM200 socket that will accept up to 2 Gbytes of DDR2-400/533 DRAM. In addition to ACPI/APM functions, the ADLS15HD has the following features: EIDE, 8xUSB 2.0, 2xRS232 COM ports, PS/2 keyboard and mouse, AC’97 and HDA 5.1 Sound and dual Gigabit Ethernet LAN. The ADLS15HD also supports ELO resistive touch screen and has an isolated 24 VDC input that is 20-30 VDC tolerant for powering the board. The ADLS15HD also provides a built-in UPS (1 second std.) that will allow for a fast but safe shutdown. The board runs on a 24 VDC power source and includes an onboard UPS, and its functionality can be expanded with an onboard miniPCI.

Advanced Digital Logic. San Diego, CA. (858) 490-0597. [www.adl-usa.com].

SBC with New Atom N455/D525 Targets High Reliability

A new ISA half-size Single Board Computer (SBC) features the latest high-performance Atom single and dual core processors. The PCA-6782 in versions N and D from Advantech integrates the Intel Atom N455/D525. The Atom D525 dual core CPU brings compact size, low power consumption, dual core parallel computing power and a maximum of 2 Gbytes of DDR2 667 MHz memory and makes PCA-6782D a powerful small form factor embedded platform for today’s applications that require high performance in small packages. The fanless single core Atom N455 CPU with a maximum of 2 Gbytes of DDR2 667 MHz memory makes PCA-6782N ultra reliable in all kinds of high-temperature and dusty environments. PCA-6782 has an integrated graphic core based on Intel’s Embedded Gen 3.5+ graphic technology with 224 Mbytes shared memory. (Figure 3)

PCA-6782 provides a rich array of I/O interfaces: it has three SATA ports (300 Mbyte/sec) for mainstream SSD (Solid State Disks), HDD and ODD connections, and legacy I/O connection: one IDE, one PS/2, one FDD and one parallel port. It also has a CF socket, a PC/104 expansion, one Gigabit Ethernet LAN for high networking capability and two COM ports. Optional Advantech COM port upgrade module (P/N: PCA-COM485-00A1E) is also available to give an extra four RS-485 ports with auto-flow control capability.

Advantech. Irvine, CA. 949-789-7178. [www.advantech.com].

3.5-inch ECX Embedded System Board with Dual-Core Atom D525

Achieving increased performance while keeping power consumption in check is the aim of a new 3.5-inch ECX compact embedded system board that includes the performance enhancing advanced features gained from Intel’s second-generation dual-core Atom processors. The new compact (146 mm x 105 mm) PEB-2771VG2A from American Portwell is suitable for a range of general applications such as medical devices, industrial automation and handheld gaming as well as embedded applications. (Figure 4)

Based on Intel’s dual-core Atom processor D525 with Intel NM10 Express Chipset, the PEB-2771VG2A board supports DDR3 800 SODIMM system memory up to 4 Gbyte, dual display via VGA and LVDS, dual Gigabit Ethernet, onboard 12V DC input, two SATA interfaces, one 44-pin IDE connector, Type II Compact Flash socket, six USB ports, four serial ports and GPIO. The dual-core 1.8 GHz processor can handle most essential applications in the low-power segment.

American Portwell. Fremont, CA. (510) 403-3399. [www.portwell.com].

Board Set Marries COM Express and Multifunction I/O

Today’s level of board integration has enabled board functions that once took several boards to now fit on a single card. A board-level “embedded-ready subsystem” (ERS) combines the benefits of computer-on-modules (COMs) with those of stackable single board computers (SBCs). This announcement means that system manufacturers no longer need to design a custom carrier to deploy COM Express modules. (Figure 5)

Called Magellan from Diamond Systems, the CPU core consists of a COM Express CPU module and heat spreader mounted on its bottom side, resulting in optimal thermal management and increased space for I/O functions and connectors. This design makes it possible for Magellan to integrate dual gigabit Ethernet LAN ports, a 7-30V DC/DC power supply, a full set of peripheral interface header connectors, stackable PCI-104 or SUMIT expansion and a FeaturePak I/O module socket, in addition to a complete embedded-PC core—all within the 95 x 125 mm COM Express footprint. Stacking boards in one direction greatly simplifies the thermal design of embedded systems based on high-end CPUs, avoiding costly custom heat pipes and milled aluminum thermal-transfer blocks.

Diamond Systems. Mountain View, CA. (800) 367-2104. [www.diamondsystems.com].

Rugged COM Express Card Suits Constrained Apps

Non-backplane, stand-alone board form factors continue to expand their acceptance among military developers. Riding that wave, GE Intelligent Platforms offers the bCOM2-L1100 rugged COM Express board. Designed specifically to respond to the growing requirement to deploy powerful computing solutions in harsh, space-constrained environments such as mining, oil and gas, manufacturing, test/measurement, unmanned vehicles, exploration, transportation and military/aerospace, it features an Intel Core2 Duo processor operating at up to 2.26 GHz and up to 4 Gbytes of soldered DDR3 SDRAM. Soldered components substantially improve reliability. (Figure 6)

The bCOM2-L1100 provides extensive protection to ensure reliable operation in applications that are subject to shock, vibration and extremes of temperature (-40° to +85°C). All components are soldered to the board for optimum reliability, while mechanical stand-offs provide a high degree of insulation from external forces. Available in a standard version for benign environments, the bCOM2-L1100 is optionally available in extended temperature variants and with conformal coating. Despite its small size, the bCOM2-L1100 offers a broad range of connectivity and I/O capabilities, including Gigabit Ethernet, eight USB 2.0 ports, four Serial ATA (SATA) ports (RAID-configurable), one PATA port, eight GPIO ports (four in, four out), one LVDS port, two SDVO channels, VGA, High Definition Audio (HDA) and PCI Express (configurable as one 4x PCI Express lane or four 1x PCI Express lanes). Also provided is a x16 PCI Express port for high-end graphics and video applications. 

GE Intelligent Platforms. Charlottesville, VA. (800) 368-2738. [www.ge-ip.com].

Atom-based Rugged SBC Is iPhone-Sized

For many of today’s military applications, it’s all about compute density. Feeding that need, General Micro Systems (GMS) has developed an Intel Atom-based rugged SBC that offers unbelievably low power consumption. Combined with its exceptionally small footprint and high performance, the Atom XPC40x (extended temperature, conduction-cooled) and Atom XP40x (standard temperature) satisfy the intense demand for an ultra-small computer with full-size processing power. (Figure 7)

Easily accommodating 64 Gbytes of storage via onboard solid-state disk in its miniature 3.5 x 2.5 x 0.5-inch package, Atom is the world’s smallest full-featured rugged computer. It boasts 533 MHz DDR-2 SDRAM and is powered by a 1.6 GHz Intel Atom processor that provides 512 Kbytes of cache. With full laptop functionality, Atom offers high-performance graphics with 3D acceleration, and includes five USB-2.0 ports and support for two Express Mini Cards for Wi-Fi, CanBus or other user I/O. The Atom XPC40x is designed to operate at -40° to +85°C with a maximum thermal gain of only 5°C above ambient. Because of its heat tolerance, it is ideal for applications where ambient temperature is high, such as a controller located in an engine compartment or for small robots and UAVs working in extreme temperatures. The Atom, with its exceptionally low power consumption/dissipation (3W average, 10W peak), imposes little to no impact on the user, eliminating many inherent problems with wearable computers. Pricing starts at $1,295 for the conduction-cooled XPC40x and $695 for the standard-temperature XP40X in single quantities.

General Micro System. Rancho Cucamonga, CA. (909) 980-4863. [www.gms4sbc.com].

Credit Card Size COM Express Card Sports Atom E6xx

The Atom CPU and the COM Express form factor are a marriage made in heaven for size- and power-constrained military systems. With that in mind, Kontron has launched a COM Express-compatible module (55 mm x 84 mm) with the new Intel Atom processor E6XX. Called the COM nanoETXexpress-TT, the card is also equipped with the newly defined PICMG COM Express COM.0.R.2 Type 10 pin-out that was added to the COM.0 R2.0 specification. With industrial grade components, functional in the range (E2) -40° to +85°C and different options for data storage, it is suitable for use in harsh environments and thus complements the existing portfolio. Finally, the nanoETXexpress COM family gains four new members, broadening the scalability from 600 MHz to 1.6 GHz and throughout the industrial-grade temperature range. (Figure 8)

The nanoETXexpress-TT customer has four PCI Express lanes of which three can be utilized for dedicated customer-specific interfaces. This enables the use of even more dedicated mini-devices in a semi-custom solution. In addition to LVDS, it offers the newly implemented Digital Display Interface (DDI) for SDVO, Display Port or HDMI that allows two displays to be controlled independently. The board also features Intel’s Platform Controller Hub EG20T, allowing the new Computer-on-Module to be configured very flexibly. In addition to three PCI Express Lanes for custom extensions, the module also supports two different options for data storage: either a robust micro-SD Card socket offering up to 32 Gbytes and 2x SATA II 300 Mbyte/s interfaces, or a planned version with industrial-grade SATA Flash Memory (up to 16 Gbytes) and 1x SATA II 300 Mbyte/s connector.

Kontron. Poway, CA.  (888) 294-4558. [www.kontron.com].

Atom-based COM Module Offers Extended Temperature Operation

Ideal for systems where the overhead of slot-card backplanes isn’t desirable, COM modules are becoming a key form factor choice for military systems. An upgraded ESMexpress Computer-on-Module (COM) incorporates the Intel Atom XL processor to provide tested, qualified operation in the extended temperature range of -40° to +85°C (-40° to +185°F) in both conduction- and convection-cooled environments. It also features an increased memory capacity of 2 Gbytes, double its predecessor. Because the enhanced XM1L from MEN Micro conforms to the ANSI-VITA 59 RSE standard currently in development, it provides a cost-effective and easily upgradeable means of employing advanced embedded technology in highly rugged applications as found in industrial, harsh, mobile and mission-critical environments. (Figure 9)

The low-power XM1L uses the Intel Atom XL processor family operating at up to 1.6 GHz in combination with an IA-32 core based on 45 nm process technology, while drawing a maximum of 7W. In addition to the upgraded 2 Gbytes of soldered DDR2 SDRAM system memory, the XM1L supports other memory, including USB flash on the carrier board and 512 Kbytes of L2 cache integrated into the processor. Pricing starts at $497.

MEN Micro. Ambler, PA. (215) 542-9575. [www.menmicro.com].

StackableUSB Carrier Boards Support SUMIT Spec

The SUMIT connector interface ranks as one of the most innovative approaches to maximized small form factor board space. Micro/sys has added to the growing line of StackableUSB carrier and hub boards with the addition of a SUMIT version, enabling StackableUSB I/O modules to make plug-and-play connections to SUMIT CPU single board computers. The CRR-SUMIT and HUB-SUMIT attach to SUMIT-enabled 104 Form Factor (3.55 x 3.775 inch) SBCs providing OEM users four bays for the powerfully small StackableUSB I/O modules that come either USB, SPI or I²C enabled. (Figure 10)

Micro/sys offers a root-port carrier and a hub version. The HUB-SUMIT expands a single USB port from the SBC into four USB channels. Alternatively, the CRR-SUMIT allows an OEM to interface with up to four separate root USB ports from the SBC, assuming the SBC has that number of Client ports. Additionally, for users who are concerned about stacking I/O devices directly over the CPU (as the SUMIT standard requires), the CRR-SUMIT and HUB-SUMIT solve OEMs’ space concerns for air circulation. The basic CRR-SUMIT starts at $125 in single quantity. The basic HUB-SUMIT starts at $150 in single quantity.

Micro/sys. Montrose, CA. (818) 244-4600. [www.embeddedsys.com].

Core i7-based Module Boasts -25° to 70°C Temp Operation

While the first generation of COM Express boards wasn’t generally rugged, a new set of products has emerged specifically crafted for harsh environments. With that in mind, the ruggedized Procelerant CEQM57XT COM Express from RadiSys combines the Intel Core i7 and i5 processors and the Mobile Intel QM57 Express chipset with extended temperature range from -25° to 70°C and ruggedized vibration specifications that are required for many mil/aero and industrial applications such as ruggedized computers/tablets, unmanned vehicles/robots and in-vehicle computers. The CEQM57XT features the Intel Core i7 2.53 GHz, 2.0 GHz and 1.06 GHz processors and the Intel Core i5 2.4 GHz processor for increased processing performance and a seven-year lifecycle, a key requirement for mil/aero and industrial applications. (Figure 11)

The board’s COM Express 1.0 Type 2 pin-out ensures smooth upgrades. Six PCI Express x1 ports, one PCI Express x8 port and optional PCI Express x16 expansion port are provided for increased peripheral performance. The board also provides Gbit Ethernet, Trusted Platform Management (TPM), optional conformal coating and optional extended and industrial temperature stand-alone SODIMM memory.

RadiSys designs ruggedness into the CEQM57XT by utilizing its proprietary implementation of the Highly Accelerated Life Test (HALT) during the design process to identify and correct product weaknesses prior to production; Highly Accelerated Sample Screen (HASS) is then used during production to continually monitor supplier quality and component robustness. Through rigorous HALT/HASS testing, RadiSys ensures that the product is designed to its extended temperature range limits required by its target markets.

RadiSys. Hillsboro, OR.  (503) 615-1100. [www.radisys.com].

1.6 GHz Intel Atom SUMIT-ISM Board Supports COMIT

The SUMIT I/O connector scheme and the COMIT Computer-on-Module standard rank as the two most significant fruits of the Small Form Factor-SIG in the past year. Supporting both is the EBC-Z530-G from WinSystems—an SBC powered by an Intel 1.6 GHz Atom processor that measures 203 mm x 147 mm (8.5 x 5.75 inch) and supports the new Stackable Unified Modular Interconnect Technology—Industry Standard Module (SUMIT-ISM) expansion standard. The RoHS-compliant EBC-Z530-G operates over an industrial temperature range of -40° to +70°C. (Figure 12)

The EBC-Z530-G’s I/O interface features two Gbit Ethernet ports, VGA and LVDS flat panel video, a PCI Express MiniCard interface for a wireless networking module, four USB 2.0 ports, four serial COM ports, HD audio, PATA controller for both a CompactFlash and hard disk, 48 lines of digital I/O, LPT and a PS/2 port for keyboard and mouse. Additional I/O module expansion is supported with two SUMIT and legacy PC/104 connectors. The EBC-Z530 supports COMIT and is targeted toward small form factor processor modules and baseboards leveraging the latest ultra-mobile and moderate power processor/chipset combinations. WinSystems is using a 62 mm x 75 mm card (which is roughly the size of a credit card) that includes the Atom, SCH, memory and power supplies.

WinSystems. Arlington, TX. (817) 274-7553. [www.winsystems.com].