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At today’s level of semiconductor integration, computer data conversion signal processing subsystems can be squeezed onto a single mezzanine card. Along just those lines,
Innovative Integration has announced the X6-1000M. The X6-1000M integrates high-speed digitizing and signal generation with signal processing on a PMC/XMC IO module for demanding DSP applications. The tight coupling of analog I/O to the Virtex-6 FPGA core dramatically simplifies SDR, radar and lidar implementations. The board features two, 12-bit 1 Gsample/s A/Ds and four 1 Gsample/s 16-bit DACs. Analog input bandwidth of over 2 GHz supports wideband applications and RF undersampling. The DACs have features for interpolation and coarse mixing for upconversion.
A Xilinx Virtex-6 SX315T (LX240T and SX475T options) with four banks of 1 Gbyte DRAM provides a very high-performance DSP core with over 2000 MACs (SX315T). The close integration of the analog I/O, memory and host interface with the FPGA enables real-time signal processing at extremely high rates. The X6-1000M power consumption is 19W for typical operation. The module may be conduction cooled using VITA20 standard and a heat spreader. Ruggedization options for wide-temperature operation from -40° to +85°C and 0.1 g2/Hz vibration.
Innovative Integration, Simi Valley, CA. (805) 578-4260. [www.innovative-dsp.com].