Page 1 of 1
A new rugged 1 ATR tall, short enclosure with independent dual liquid cooled side walls offers significantly better cooling than conduction only and air-flow designs. Targeted for highly dense embedded systems with exceptional heat dissipation requirements, the new platform holds 6U conduction cooled boards with a 1" pitch per VITA 48.2 (REDI) and VITA 65 (OpenVPX). The new liquid cooled chassis is available with a 6U OpenVPX backplane on a 1" pitch per VITA 65 Backplane Profile BKP6-CEN07-11.2.3-n. The backplane provides seven slots, each cooled up to 100 W; one slot for storage, one for switch and five payload slots. Additional backplanes are available, including VME, VME64x, VXS, cPCI or custom backplanes. The unit offers users the choice of a fixed-mount 400 W or 500 W 6U plug-in power supply. Dimensions of the new chassis are 10.625" H x 10.12" W x 12.52" L.
This new enclosure is designed to meet shock and vibration standards per MIL-STD-810G, as well as MIL-STD-810F, MIL-STD-901D and MIL-STD-461F (CE102, CS101, CS116, RE102, RS103). It can operate at altitudes of up to 75,000 feet. Operating temperature is -55°C to 70°C and storage temperature is -62°C to 95°C. Pricing starts at $30,000, including the backplane and power supply.